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832-0472 Datasheet (PDF) - LM Technologies Ltd

832-0472 Datasheet PDF - LM Technologies Ltd
Part # 832-0472
Download  832-0472 Download
File Size   14196.98 Kbytes
Page   15 Pages
Manufacturer  LMTECHNOLOGIES [LM Technologies Ltd]
Direct Link  https://www.lm-technologies.com/
Logo LMTECHNOLOGIES - LM Technologies Ltd
Description LM832 WiFi and Bluetooth® Dual Mode Combi Module Standalone with SDIO and UART Interfaces

832-0472 Datasheet (PDF)

Go To PDF Page Download Datasheet
832-0472 Datasheet PDF - LM Technologies Ltd

Part # 832-0472
Download  832-0472 Click to download

File Size   14196.98 Kbytes
Page   15 Pages
Manufacturer  LMTECHNOLOGIES [LM Technologies Ltd]
Direct Link  https://www.lm-technologies.com/
Logo LMTECHNOLOGIES - LM Technologies Ltd
Description LM832 WiFi and Bluetooth® Dual Mode Combi Module Standalone with SDIO and UART Interfaces

832-0472 Datasheet (HTML) - LM Technologies Ltd


832-0472 Product details

Features
WiFi 802.11 b/g/n
Bluetooth® v4.1 specification (Dual Mode)
SDIO for WiFi and UART (High Speed) for Bluetooth
IPEX Connector or PCB Antenna options
Full speed Bluetooth® Piconet and Scatternet supported
Enterprise level security - WPA/WPA2 certification for WiFi
1T 1R, Supporting 150Mbps Bandwidth
Support sophisticated WiFi/BT coexistence mechanism to enhance collection performance
Support Bluetooth adaptive power management mechanism
19mm x 12mm x 2mm
SMT Side and Bottom Pads for easy production
See our website for this products certifications.
RoHS, REACH and WEEE

Overview
The LM832 module incorporates an intelligent coexistances mechanism for WiFi 802.11 b/g/n via SDIO and Dual Mode Bluetooth® v4.1 via UART. This is ideal for significantly minimising the BoM cost and PCB space.
This versatile module combines WiFi and Bluetooth® radios, plus an ARM Cortex M3 microcontroller with an 8 MB flash memory for running the application. It also incorporates 4 GPIO pins for interfacing with peripheral devices.
The LM832 utilises a powerful Cypress chipset, which enables the LM832 HCI Module to be compatible with the latest Android platform, Linux Kernel v4.3.6 and Android4.4_V2.19.
It’s SMT side and bottom pads allow for easy manufacture and placement within your product.




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