DESCRIPTION
Highly activated, organic, halide flux conforming DIN EN 29454 2.1.2 (DIN 8511 F-SW25)for soldering operations on metals,
in the apparatus engineering and the electro-technics. Liquid flux 200-2520 has - in spite of the low solid contents - good
wetting properties, even on metal surfaces which are difficult to solder, such as bronze, brass, nickel and copper-beryllium.
APPLICATION
Stannol liquid flux 200-2520 is a highly activated flux used for soldering operations on metal surfaces that are difficult to
solder. It can be applied by brushing, dispensing or dipping.
The optimum soldering efficiency is achieved at temperatures around 250° C. The flux leaves only low residues which are in
most cases invisible. The flux residues are water-soluble, can be corrosive and evaporate during the soldering process,
depending on the temperature applied.
Evaporation of solvent can change the composition. Evaporation causes an increase of the solid content and therefore the
density increases. This can be checked with the Stannol Mini-Titration-Kit.