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0705670120 Datasheet (PDF) - Molex Electronics Ltd.
0705670120 Datasheet PDF - Molex Electronics Ltd.
Part # 0705670120
Download  0705670120 Download
File Size   1222.56 Kbytes
Page   7 Pages
Manufacturer  MOLEX8 [Molex Electronics Ltd.]
Direct Link  http://www.molex.com
Logo MOLEX8 - Molex Electronics Ltd.
Description 2.54mm (.100") Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, VerticalShrouded, High Temperature, 40 Circuits, Tin (Sn) Plating

0705670120 Datasheet (PDF)

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0705670120 Datasheet PDF - Molex Electronics Ltd.

Part # 0705670120
Download  0705670120 Click to download

File Size   1222.56 Kbytes
Page   7 Pages
Manufacturer  MOLEX8 [Molex Electronics Ltd.]
Direct Link  http://www.molex.com
Logo MOLEX8 - Molex Electronics Ltd.
Description 2.54mm (.100") Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, VerticalShrouded, High Temperature, 40 Circuits, Tin (Sn) Plating

0705670120 Datasheet (HTML) - Molex Electronics Ltd.




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Molex Electronics Ltd.		 0705670125 MOLEX8-0705670125 Datasheet
1Mb / 7P		 2.54mm (.100") Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, VerticalShrouded, High Temperature, 50 Circuits, Tin (Sn) Plating
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Similar Description - 0705670120

ManufacturerPart #DatasheetDescription
logo
Molex Electronics Ltd.		 0015800541 MOLEX2-0015800541 Datasheet
1Mb / 7P		 2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 54 Circuits, Tin (Sn) Plating
0015800361 MOLEX2-0015800361 Datasheet
1Mb / 7P		 2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 36 Circuits, Tin (Sn) Plating
0015800401 MOLEX2-0015800401 Datasheet
1Mb / 7P		 2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 40 Circuits, Tin (Sn) Plating
0015800501 MOLEX2-0015800501 Datasheet
1Mb / 7P		 2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 50 Circuits, Tin (Sn) Plating
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1Mb / 7P		 2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, Tin (Sn) Plating
0705670125 MOLEX8-0705670125 Datasheet
1Mb / 7P		 2.54mm (.100") Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, VerticalShrouded, High Temperature, 50 Circuits, Tin (Sn) Plating
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1Mb / 7P		 2.54mm (.100") Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, VerticalShrouded, High Temperature, 62 Circuits, Tin (Sn) Plating
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1Mb / 7P		 2.54mm (.100") Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, VerticalShrouded, High Temperature, 50 Circuits, Tin (Sn) Plating
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About Molex Electronics Ltd.

Molex Electronics Ltd. is a subsidiary of Koch Industries, Inc., and is a global manufacturer of electronic and fiber optic interconnect solutions.

The company was founded in 1938 and is headquartered in Lisle, Illinois.

Molex offers a wide range of interconnect products including connectors, cable assemblies, switches, and other passive components.

These products are used in various industries including automotive, data communications, consumer electronics, industrial equipment, medical devices, and telecommunications.

With operations and facilities in over 40 countries, Molex is known for its innovation and technology leadership in the interconnect solutions market.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.




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