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LX5553 Datasheet (PDF) - Microsemi Corporation

LX5553 Datasheet PDF - Microsemi Corporation
Part # LX5553
Download  LX5553 Download
File Size   93.3 Kbytes
Page   3 Pages
Manufacturer  MICROSEMI [Microsemi Corporation]
Direct Link  http://www.microsemi.com
Logo MICROSEMI - Microsemi Corporation
Description 2.4-2.5 GHz Front-End Module with Internally Matched Power Amplifier, LNA & SP3T Switch

LX5553 Datasheet (PDF)

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LX5553 Datasheet PDF - Microsemi Corporation

Part # LX5553
Download  LX5553 Click to download

File Size   93.3 Kbytes
Page   3 Pages
Manufacturer  MICROSEMI [Microsemi Corporation]
Direct Link  http://www.microsemi.com
Logo MICROSEMI - Microsemi Corporation
Description 2.4-2.5 GHz Front-End Module with Internally Matched Power Amplifier, LNA & SP3T Switch

LX5553 Datasheet (HTML) - Microsemi Corporation


LX5553 Product details

DESCRIPTION
LX5553 is a high-integration, highperformance WLAN front-end module (FEM) for 802.11b/g/n and other applications in the 2.4-2.5GHz frequency range. LX5553 integrates an advanced InGaP/GaAs Hetero-junction Bipolar Transistor (HBT) power amplifier with on chip impedance matching, a fully matched low noise amplifier based on InGaAs Enhancement mode pseudo-morphic high electron mobility transistor (E-pHEMT) technology, and a Depletion mode pHEMT (D-pHEMT) singlepole triple-throw (SP3T) switch, all into a single package with 3x3mm footprint. LX5553 provides capability of sharing a single antenna between WLAN and Bluetooth systems through the SP3T switch.

KEY FEATURES
◾ 2.4-2.5GHz 802.11b/g/n FrontEnd Solution in a Single MLP Package
◾ SP3T for Sharing Antenna between WLAN and Bluetooth systems
◾ All RF I/O Matched to 50 
◾ Single-Supply Voltage 3.0V to 4.2V
◾ Small Footprint: 3x3mm2
◾ Low Profile: 0.55mm
◾ RoHS Compliant & Pb-Free

TX Features :
◾ Power Gain ~ 25 dB*
◾ Pout ~ +17 dBm* for 3% EVM at Antenna
◾ Current ~145 mA at +17 dBm*
◾ Pout ~ +21 dBm* for 11b 1Mbps DSSS Mask Compliance
◾ Quiescent Current ~ 82 mA

RX Features :
◾ Gain ~ 13 dB*
◾ Noise Figure ~ 2.1 dB*
◾ IIP3 ~ +5 dBm*

Bluetooth Path :
◾ Insertion Loss ~ 0.9 dB
◾ IP1dB ~ +29 dBm
* Including SP3T switch loss

APPLICATIONS
◾ IEEE 802.11b/g/n
◾ Mobile Phone WLAN module




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About Microsemi Corporation


Microsemi Corporation was an American company that specialized in the design and manufacture of semiconductor and system solutions.
The company was founded in 1960 and was headquartered in Aliso Viejo, California.
Microsemi provided a wide range of products including analog and mixed-signal integrated circuits, field-programmable gate arrays (FPGAs), power management and control products, and other semiconductor solutions.
The company's products were used in various applications such as defense and security, aerospace and aviation, industrial, and communications.
Microsemi was known for its expertise in semiconductor technology and its ability to deliver high-quality and reliable products to its customers.
In 2018, Microsemi was acquired by Microchip Technology, a leading provider of microcontroller, mixed-signal, analog, and security products.
The Microsemi brand is no longer in use, but its technology and products continue to be a part of Microchip's portfolio.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.




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