| Manufacturer | Part # | Datasheet | Description |
 Kyocera Kinseki Corpota... |
CX-101F
|
156Kb / 1P |
Ultra-thin, thickness 0.75mm. (3.2횞2.5횞0.75mm)
|
 Maxim Integrated Produc... |
21-0136F
|
55Kb / 2P |
PACKAGE OUTLINE 12,16L THIN QFN, 3x3x0.8mm
Rev F |
 fujitsu semiconductor |
FPT-20P-M04
|
37Kb / 1P |
THIN SHRINK SMALL OUTLINE PACKAGE
|
 Dallas Semiconductor |
21-0102
|
109Kb / 2P |
PACKAGE OUTLINE, 12,16L QFN, 3x3x0.90 MM
|
 Maxim Integrated Produc... |
21-0139
|
74Kb / 2P |
PACKAGE OUTLINE, 12,16,20,24,28L TQFN, 4*4*0.75MM
REV .L |
|
21-0140
|
59Kb / 2P |
PACKAGE OUTLINE, 16,20,28,32,40L THIN QFN, 5*5*0.75MM
REV .Q |
|
21-0141
|
104Kb / 2P |
PACKAGE OUTLINE, 36,40,48L THIN QFN, 6*6*0.75MM
Rev N |
|
21-0181
|
66Kb / 2P |
PACKAGE OUTLINE, 43L THIN QFN, 3.5*9*0.8MM
REV .C |
|
21-0429
|
71Kb / 2P |
PACKAGE OUTLINE, 10L TDFN, 3*2*0.75MM
REV .C |
|
21-0664
|
46Kb / 2P |
PACKAGE OUTLINE 12L TDFN, 3*3*0.75MM
REV .B |