| Manufacturer | Part # | Datasheet | Description |
 Allegro MicroSystems |
ACS709
|
474Kb / 16P |
High Bandwidth, Fast Fault Response Current Sensor IC In Thermally Enhanced Package
|
 Seoul Semiconductor |
STW8B12B
|
871Kb / 30P |
Thermally Enhanced Package Design
|
|
STW8B12G
|
911Kb / 29P |
Thermally Enhanced Package Design
|
|
STW8C2PA
|
1Mb / 31P |
Thermally Enhanced Package Design
|
|
STW9B12G
|
718Kb / 24P |
Thermally Enhanced Package Design
|
|
STW9C2SA
|
1Mb / 32P |
Thermally Enhanced Package Design
|
 Allegro MicroSystems |
ACS709
|
746Kb / 21P |
High-Bandwidth, Fast Fault Response Current Sensor IC
|
 Seoul Semiconductor |
STW7C12Y
|
886Kb / 25P |
Thermally Enhanced Package Design
|
|
STW8C2SB-NZ
|
1Mb / 30P |
Thermally Enhanced Package Design
|
 Melexis Microelectronic... |
MLX91209
|
1Mb / 15P |
Current Sensor IC in VA package
|