| Manufacturer | Part # | Datasheet | Description |
Samsung semiconductor |
KAB01D100M
|
1Mb / 72P |
Multi-Chip Package MEMORY
|
fujitsu semiconductor |
MB81ES653225-12
|
485Kb / 10P |
Consumer/Embedded Application Specific Memory for SiP
|
Intel Corporation |
28F640P3
|
1Mb / 102P |
Intel StrataFlash Embedded Memory
|
Infineon Technologies A... |
PLF2224
|
499Kb / 2P |
24 2G Switch on a Chip with Embedded Memory
|
Amkor Technology |
PSVFBGA
|
251Kb / 2P |
Package on Package (PoP) Family
|
Analog Devices |
ADSP-BF523C
|
2Mb / 44P |
Blackfin Embedded Processor 289-ball MBGA package
Rev. PrC |
SPANSION |
S34ML01G1
|
2Mb / 73P |
Spansion짰 SLC NAND Flash Memory for Embedded
|
Micron Technology |
MT29C4G48MAZAPAKD-5IT
|
428Kb / 15P |
NAND Flash and Mobile LPDRAM 152-Ball Package-on-Package (PoP) Combination Memory (TI OMAP?? MT29C Family
|
OSRAM GmbH |
CHDELSS1.22
|
677Kb / 22P |
Wearables
|
HK TO-GRACE TECHNOLOGY ... |
LTW-020ZDCG-E2
|
681Kb / 11P |
Package in 12mm tape on 7
|
British ▼ 
English
Chinese
German
Japanese
Russian
Korean
Spanish
French
Italian
Portuguese
Polish
Vietnamese
Indian
Mexican
British
New Zealand
