AD8232ACPZ-R7 datasheet(28/29 Pages) AD

28 / 29 page

Data Sheet

AD8232

Rev. B | Page 27 of 28

PACKAGING AND ORDERING INFORMATION

OUTLINE DIMENSIONS

Figure 69. 20-Lead Lead Frame Chip Scale Package [LFCSP]

4 mm × 4 mm Body and 0.75 mm Package Height

(CP-20-8)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature Range

Package Description

Package Option

AD8232ACPZ-R7

−40°C to +85°C

20-Lead Lead Frame Chip Scale Package [LFCSP]

CP-20-8

AD8232ACPZ-RL

−40°C to +85°C

20-Lead Lead Frame Chip Scale Package [LFCSP]

CP-20-8

AD8232ACPZ-WP

−40°C to +85°C

20-Lead Lead Frame Chip Scale Package [LFCSP]

CP-20-8

AD8232-EVALZ

Evaluation Board

Z = RoHS Compliant Part.

0.50

BSC

0.50

0.40

0.30

0.25

0.18

COMPLIANT

TO JEDEC STANDARDS MO-220-WGGD-11.

4.10

4.00 SQ

3.90

0.80

0.75

0.70

0.05 MAX

0.02 NOM

0.20 REF

0.25 MIN

COPLANARITY

0.08

PIN 1

INDICATOR

2.75

2.60 SQ

2.35

BOTTOM VIEW

TOP VIEW

SIDE VIEW

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

EXPOSED

PAD

SEATING

PLANE

PIN 1

INDIC ATOR AREA OPTIONS

(SEE DETAIL A)

DETAIL A

(JEDEC 95)

AD8232ACPZ-R7 Datasheet(PDF) 28 Page - Analog Devices

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