IW1815 datasheet(4/6 Pages) DIALOG

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iW1815 Product Summary

Off-Line Digital Green-Mode PWM Controller

Integrated with Power BJT

Rev. 0.1 Preliminary

iW1815

Product Summary

4 of 6

Parameter

Symbol

Value

Units

DC supply voltage range (pin 2, ICC = 20mA max)

VCC

-0.3 to 18

Continuous DC supply current at VCC pin (VCC = 15V)

ICC

VSENSE input (pin 8, IVsense ≤ 10mA)

-0.7 to 4.0

ISENSE input (pin 6)

-0.3 to 4.0

ESD rating per JEDEC

HBM

2000

200

CDM

1000

Latch-up test per JESD78A

±100

Collector-Emitter breakdown voltage

(Emitter and base shorted together; IC = 1mA, REB = 0Ω)

VCES

800

Collector current1

1.5

Collector peak current1 (tp < 1ms)

ICM

Maximum junction temperature

TJMAX

150

°C

Storage temperature

TSTG

-55 to 150

°C

Absolute maximum ratings are the parameter values or ranges which can cause permanent damage if exceeded. For

maximum safe operating conditions, refer to iW1815 datasheet in Section 7.0. (TA = 25°C, unless otherwise noted). Proper

design precautions must be made to ensure that the internal die junction temperature of the iW1815 does not exceed 150°C.

Otherwise permanent damage to the device may occur.

5.0 Absolute Maximum Ratings

6.0 Thermal Characteristics

Parameter

Symbol

Value

Units

Thermal Resistance Junction-to-Ambient1 (Dissipated power 0.9W)

θJA

103

°C/W

Thermal Resistance Junction-to-GND pin (pin 7)2

(Dissipated power 0.9W)

ψJB

°C/W

Thermal Resistance Junction-to-Collector pin (pin 4)2

(Dissipated power 0.9W)

ψJ-BJT

°C/W

Thermal Shutdown Threshold3

TSD

150

°C

Thermal Shutdown Recovery3

TSD-R

100

°C

Notes:

1. θJA is measured in a one-cubic-foot natural convection chamber.

2. ψJB [Psi Junction to Board] provides an estimation of the die junction temperature relative to the PCB [Board] surface

temperature. ψJ-BJT [Psi Junction to Collector pin] provides an estimation of the die junction temperature relative

to the collector pin [internal BJT Collector] surface temperature. ψJB is measured at the ground pin (pin 7) without

using any thermal adhesives. See Section 10.14 for more information.

3. These parameters are typical and they are guaranteed by design.

Notes:

Note 1. Limited by maximum junction temperature.

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