DG3001/3002/3003

Vishay Siliconix

New Product

Document Number: 72505

S-32069—Rev. A, 27-Oct-03

www.vishay.com

7

PACKAGE OUTLINE

MICRO FOOT: 6-BUMP (3 X 2, 0.5-mm PITCH, 165-mm BUMP HEIGHT)

NOTES (Unless Otherwise Specified):

1.

Bump is Eutectic 63/57 Sn/Pb.

2.

Non-solder mask defined copper landing pad.

3.

Laser Mark on silicon die back; no coating. Shown is not actual marking; sample only.

Index-Bump A1

Note 3

Top Side (Die Back)

XXX

3003

Recommended Land Pattern

0.5

0.5

6

O 0.150 X 0.180

Note 2

Solder Mask O X Pad Dia. + 0.1

Silicon

Bump

Note 1

b Diameter

32

1

A

B

e

D

e

A

S

S

E

MILLIMETERS*

INCHES

Dim

Min

Max

Min

Max

A

0.610

0.685

0.0240

0.0270

0.140

0.190

0.0055

0.0075

0.470

0.495

0.0185

0.0195

b

0.180

0.250

0.0071

0.0098

D

1.490

1.515

0.0587

0.0596

E

0.990

1.015

0.0390

0.0400

e

0.5 BASIC

0.0197 BASIC

S

0.245

0.258

0.0096

0.0101

* Use millimeters as the primary measurement.