Version 0.0

GW DASPA1.UC

2012-12-14

13

DRAFT – For Reference only. Subject to change.

Reflow Soldering Profile

Reflow-Lötprofil

Preconditioning: JEDEC Level 2 acc.to

J-STD-020D.01

Profile Feature

Symbol

Pb-Free (SnAgCu) Assembly

Unit

Minimum

Recommendation

Maximum

Ramp-up Rate to Preheat*

)

25 °C

O T O150 °C

2

3

K/s

Time t

(150 °C

O T

200 °C

t

S

60

100

120

s

Ramp-up Rate to Peak*

)

T

T

O T

P

2

3

K/s

Liquidus Temperature T

L

T

L

217

°C

Time above Liquidus Temperature

t

L

80

100

s

Time

25 °C

O T O T

P

480

s

Peak Temperature

T

P

245

260

°C

Time within 5 °C of the specified peak

temperature T

t

P

10

20

30

s

Ramp-down Rate*

T

T

O 100 °C

3

6

K/s

All temperatures refer to the center of the package, measured on the top of the component

* slope calculation

ΔT/Δt: Δt max. 5 sec; fulfillment for the whole T-range

0

0

s

OHA04525

50

100

150

200

250

300

50

100

150

200

250

300

t

T

˚C

S

t

t

P

t

T

p

240 ˚C

217 ˚C

245 ˚C

25 ˚C

L