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MP1400GC Datasheet(PDF) 13 Page - Monolithic Power Systems |
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MP1400GC Datasheet(HTML) 13 Page - Monolithic Power Systems |
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13 / 15 page ![]() MP1400 – NEGATIVE DCDC POWER CONVERTER MP1400 Rev.1.1 www.MonolithicPower.com 13 5/27/2015 MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited. © 2015 MPS. All Rights Reserved. Additional output capacitance may also be required to reduce ripple in DCM mode and to ensure stability in PWM mode, especially at higher output load current. Power Dissipation IC power dissipation plays an important role in circuit design—not only because of efficiency concerns, but also because of the chip’s thermal requirements. Several parameters influence power dissipation, such as: Conduction Loss (Cond) Dead time (DT) Switching Loss (SW) MOSFET Driver Current (DR) Supply Current (S) Based on these parameters, we can estimate the power loss to equal: LOSS Cond DT SW DR S PP P P P P PCB Layout Layout is important, especially for switching power supplies with high switching frequencies; poor layout results in reduced performance, EMI problems, resistive loss, and even system instability. Following the rules below can help ensure a stable layout design: 1. Connect the GND pin to the large ground plane by point connect mode. 2. Put the input capacitor as close as possible to the VIN pin while keep the GND end of the output capacitor close to the GND end of the input capacitor. 3. Put the cathode of the schottky close to the SW pin and the anode of the schottky close to the output capacitor to minimize parasitic inductance. 4. Route SW away from sensitive analog areas such as FB. It’s not recommended to route SW trace under chip’s bottom side. Notes: 7) The recommended layout is based on the Figure 3 Typical Application circuit on the next page. VIN R1 GND SW L1 GND C2A R2 U1 C2B C2C D1 VOUT VIN Design Example Below is a design example following the application guidelines for the specifications: Table 2: Design Example VIN 5V VOUT -5V Io 0.6A The detailed application schematic is shown in Figure 3. The typical performance and circuit waveforms have been shown in the Typical Performance Characteristics section. For more device applications, please refer to the related Evaluation Board Datasheets. |
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