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MP103 Datasheet(PDF) 2 Page - Monolithic Power Systems |
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MP103 Datasheet(HTML) 2 Page - Monolithic Power Systems |
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2 / 20 page ![]() MP103 EASYPOWERTM –HIGHER POWER OFFLINE INDUCTOR- LESS REGULATOR MP103 Rev. 1.01 www.MonolithicPower.com 2 1/23/2014 MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited. © 2014 MPS. All Rights Reserved. ORDERING INFORMATION Part Number* Package Top Marking MP103GN SOIC8E MP103 * For Tape & Reel, add suffix –Z (e.g. MP103GN–Z); PACKAGE REFERENCE TOP VIEW DR EXPOSED PAD ON BACK SIDE VB VOUT GND FB RT 1 2 3 4 8 VIN 5 6 7 NC ABSOLUTE MAXIMUM RATINGS (1) VIN ............................................. -0.7V to 700V VOUT ............................................ -0.3V to 15V VB.................................................. -0.3V to 35V DR ................................................. -0.3V to 30V FB................................................. -0.3V to 6.5V RT……………………………………-0.3V to 6.5V Continuous Power Dissipation (TA = +25°C) (2) SOIC8E .....................................................2.5W Junction Temperature............................. 150 oC Lead Temperature .................................. 260 oC Storage Temperature............. -55 oC to +150 oC ESD Capability Human Body Mode ………2kV Recommended Operating Conditions (3) 50/60Hz AC RMS Voltage ............. 85V to 305V VB...................................................... 8V to 30V Operating Junction Temp TJ .... -40°C to +150°C Thermal Resistance (4) θJA θJC SOIC8E 50 ..... 10 °C/W Notes: 1) Exceeding these ratings may damage the device. 2) The maximum allowable power dissipation is a function of the maximum junction temperature TJ (MAX), the junction-to- ambient thermal resistance θJA, and the ambient temperature TA. The maximum allowable continuous power dissipation at any ambient temperature is calculated by PD (MAX) = (TJ (MAX)-TA)/θJA. Exceeding the maximum allowable power dissipation will cause excessive die temperature, and the regulator will go into thermal shutdown. Internal thermal shutdown circuitry protects the device from permanent damage. 3) The device is not guaranteed to function outside of its operating conditions. 4) Measured on JESD51-7, 4-layer PCB. |
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