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MP3361 Datasheet(PDF) 2 Page - Monolithic Power Systems

Part # MP3361
Description  300V, 1A Peak, Integrated Photo Flash Charger and IGBT Driver
PDF  7 Pages
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Manufacturer  MPS [Monolithic Power Systems]
Direct Link  http://www.monolithicpower.com
Logo MPS - Monolithic Power Systems

MP3361 Datasheet(HTML) 2 Page - Monolithic Power Systems

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MP3361 – 300V, 1A PEAK INTEGRATED PHOTO FLASH CHARGER AND IGBT DRIVER
MP3361 Rev. 0.9
www.MonolithicPower.com
2
4/13/2010
MPS Proprietary Information. Unauthorized Photocopy and Duplication Prohibited.
© 2010 MPS. All Rights Reserved.
ORDERING INFORMATION
Part Number*
Package
Top Marking
Free Air Temperature (TA)
MP3361
3x3mm MSOP10
3361D
–40
°C to +85°C
*
For Tape & Reel, add suffix –Z, (e.g. MP3361DK–Z);
For RoHS Compliant Packaging, add suffix –LF, (e.g. MP3361DK–LF–Z)
PACKAGE REFERENCE
RDYB
SW
IGBTOUT
IGBTIN
N/C
1
2
3
4
5
10
9
8
7
6
FB
N/C
CHG
GND
VIN
TOP VIEW
ABSOLUTE MAXIMUM RATINGS
(1)
VIN to GND .........................................-0.3Vto 6V
CHG, IGBTIN, IGBTOUT,
RDYB to GND ...................................-0.3Vto 6V
FB to GND .....................................-60V to 350V
SW to GND .....................................-0.3V to 60V
Storage Temperature…………..-55
°C to +150°C
Continuous Power Dissipation (TA = +25°C)
(2)
............................................................ 2.5W
Junction Temperature............................ +150
°C
Lead Temperature (Solder)………………+260
°C
Recommended Operating Conditions
(3)
Supply Voltage VIN .............................2.5V to 6V
Operating Junt. Temp. (TJ) ..... –40°C to +125°C
Thermal Resistance
(4)
θJA
θJC
3x3mm MSOP10....................150 ..... 65 ...
°C/W
Notes:
1) Exceeding these ratings may damage the device.
2) The maximum allowable power dissipation is a function of the
maximum junction temperature TJ (MAX), the junction-to-
ambient thermal resistance θJA, and the ambient temperature
TA. The maximum allowable continuous power dissipation at
any ambient temperature is calculated by PD (MAX) = (TJ
(MAX)-TA)/θJA. Exceeding the maximum allowable power
dissipation will cause excessive die temperature, and the
regulator will go into thermal shutdown. Internal thermal
shutdown circuitry protects the device from permanent
damage.
3) The device is not guaranteed to function outside of its
operating conditions.
4) Measured on JESD51-7 4-layer board.



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