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OPA187, OPA2187, OPA4187

SBOS807B – DECEMBER 2016 – REVISED OCTOBER 2018

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Product Folder Links: OPA187 OPA2187 OPA4187

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Copyright © 2016–2018, Texas Instruments Incorporated

Table of Contents

1

Features .................................................................. 1

2

Applications ........................................................... 1

3

Description ............................................................. 1

4

Revision History..................................................... 2

5

Pin Configuration and Functions ......................... 3

6

Specifications......................................................... 5

6.1

Absolute Maximum Ratings ...................................... 5

6.2

ESD Ratings.............................................................. 5

6.3

Recommended Operating Conditions ....................... 5

6.4

Thermal Information: OPA187 .................................. 6

6.5

Thermal Information: OPA2187 ................................ 6

6.6

Thermal Information: OPA4187 ................................ 6

6.7

Electrical Characteristics: High-Voltage Operation .. 7

6.8

Electrical Characteristics: Low-Voltage Operation... 8

6.9

Typical Characteristics .............................................. 9

7

Detailed Description ............................................ 16

7.1

Overview ................................................................. 16

7.2

Functional Block Diagram ....................................... 16

7.3

Feature Description................................................. 17

7.4

Device Functional Modes........................................ 20

8

Application and Implementation ........................ 21

8.1

Application Information............................................ 21

8.2

Typical Applications ................................................ 21

9

Power Supply Recommendations ...................... 25

10

Layout................................................................... 26

10.1

Layout Guidelines ................................................. 26

10.2

Layout Example .................................................... 26

11

Device and Documentation Support ................. 27

11.1

Device Support .................................................... 27

11.2

Documentation Support ....................................... 27

11.3

Related Links ........................................................ 28

11.4

Receiving Notification of Documentation Updates 28

11.5

Community Resources.......................................... 28

11.6

Trademarks ........................................................... 28

11.7

Electrostatic Discharge Caution ............................ 28

11.8

Glossary ................................................................ 28

12

Mechanical, Packaging, and Orderable

Information ........................................................... 28

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision A (July 2017) to Revision B

Page

•

Changed OPA187 SOIC status to preview ............................................................................................................................ 1

•

Changed OPA4187 SOIC, TSSOP and WQFN status to preview ......................................................................................... 1

•

Changed offset drift (high supply) typical from ±5 nV/

℃ to ±1 nV/℃ and max from ±50 nV/℃ to ±20 nV/℃ ...................... 7

•

Changed input bias current max (high supply) from ±5 nA to ±7.5 nA .................................................................................. 7

•

Changed input offset current max (high supply) from ±5 nA to ±14.5 nA .............................................................................. 7

•

Changed offset drift (low supply) typical from ±5 nV/

℃ to ±1 nV/℃ and max from ±50 nV/℃ to ±20 nV/℃ ........................ 8

•

Changed Offset Voltage Production Distribution figure........................................................................................................ 10

Changes from Original (December 2016) to Revision A

Page

•

Deleted VSON package option from the Description ............................................................................................................. 1

•

Deleted VSON package option from the Device Information table ........................................................................................ 1

•

Added WQFN package option to the Device Information table.............................................................................................. 1

•

Deleted OPA187 DRG package option from Pin Configuration and Functions ..................................................................... 3

•

Added WQFN package to Pin Configuration and Functions .................................................................................................. 4