3

20ETF..S HV QUIET

I2128 rev. A 01/2000

T

J

Max.JunctionTemperatureRange

-40to150

°C

T

stg

Max.StorageTemperatureRange

-40to150

°C

R

thJC

Max.ThermalResistanceJunction

0.9

°C/W

DCoperation

toCase

R

thJA

Max.ThermalResistanceJunction

62

°C/W

toAmbient(PCBMount)**

T

s

SolderingTemperature

240

°C

wt

ApproximateWeight

2(0.07)

g(oz.)

Case Style

Thermal-Mechanical Specifications

Parameters

20ETF..S

Units

Conditions

Fig. 1 - Current Rating Characteristics

Fig. 2 - Current Rating Characteristics

Fig. 3 - Forward Power Loss Characteristics

Fig. 4 - Forward Power Loss Characteristics

Forrecommendedfootprintandsolderingtechniquesrefertoapplicationnote#AN-994

100

110

120

130

140

150

0

5

10

15

20

25

30°

60°

90°

120°

180°

Conduction Angle

Average Forward Current (A)

20ETF.. Series

R

(DC) = 0.9 K/W

thJC

100

110

120

130

140

150

0

5

10

15

20

25

30

35

DC

30°

60°

90°

120°

180°

Conduction Period

Average Forward Current (A)

20ETF.. Series

R

(DC) = 0.9 K/W

thJC

0

5

10

15

20

25

30

35

0

5

10

15

20

25

RMS Limit

180°

120°

90°

60°

30°

Conduction Angle

Average Forward Current (A )

20ETF.. Series

T

= 150°C

J

0

5

10

15

20

25

30

35

40

45

0

5

10

15

20

25

30

35

DC

180°

120°

90°

60°

30°

RMS Limit

Conduction Period

Average Forward Current (A)

20ETF.. Series

T = 150°C

J