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EMIF02-USB03F2 Datasheet(PDF) 5 Page - STMicroelectronics |
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EMIF02-USB03F2 Datasheet(HTML) 5 Page - STMicroelectronics |
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5 / 7 page ![]() EMIF02-USB03F2 5/7 Figure 11: Order Code Figure 12: FLIP-CHIP Package Mechanical Data Figure 14: Foot Print Recommendations Figure 15: Marking EMIF yy - xxx zz Fx EMI Filter Number of lines Information Package x = resistance value (Ohms) z = capacitance value / 10(pF) or 3 letters = application 2 digits = version F = Flip-Chip x = 1: 500µm, Bump = 315µm = 2: Leadfree Pitch = 500µm, Bump = 315µm 1.57mm ± 50µm 315µm ± 50 500µm ± 50 650µm ± 65 Copper pad Diameter : 250µm recommended, 300µm max. Solder stencil opening : 330µm recommended Solder mask opening recommendation : 340µm min. for 300µm copper pad diameter E x y x w z w 565 400 Dot, ST logo xx = marking z = packaging location yww = datecode (y = year ww = week) All dimensions in µm |
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