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UF2768G-SM2-R Datasheet(PDF) 7 Page - Unisonic Technologies |
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UF2768G-SM2-R Datasheet(HTML) 7 Page - Unisonic Technologies |
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7 / 8 page ![]() UF2768 Preliminary CMOS IC UNISONIC TECHNOLOGIES CO., LTD 7 of 8 www.unisonic.com.tw QW-R140-012.a APPLI CAT I ON I N FORM AT I ON Input Protection Diode & Capacitor It is necessary to add a protection diode (D1) to prevent the damage from the power reverse connection. However, the protection diode will cause a voltage drop on the supply voltage. The current rating of the diode must be larger than the maximum output current. For the noise reduction purpose, a capacitor (C1) is connected between VCC and GND. (see Typical Application Circuit) It’s suggested that C1 should be placed as close as possible in the VCC pin. OSC Capacitor The capacitor connects from OSC pin to GND can be determined the frequency of force commutation. The optimal design of the frequency could make sure the motor start-up in succeed. Its capacitance from 1000pF to 3300pF is recommended. FG Resistor The value of FG resistor could be decided by the following equation: CC FG/RD FG FG/RD V-V R= I For example: VCC=5V, IFG=5mA, VFG=0.2V, RFG=0.96k Ω The value of resistor in the range of 1kw to 10kw is recommended. Thermal Consideration Refer to “Maximum Power Dissipation vs. Ambient Temperature”, the IC is safe to operate below the curve and it will cause the thermal protection if the operating area is above the line. For example, TA= 75°C, the MSOP-10 package maximum power dissipation is about 0.48W. The power dissipation can be calculated by the following equation: DCC UO VO UO CC CC ×I +V P=(V - ) V- ×I V For example: VCC=5V, ICC=3mA, IOUT=250mA, VUO=4.85V, VVO=0.15V, then PD=0.09W The GND pin provides an electrical connection to the ground and channeling heat away. The printed circuit board (PCB) forms a heat sink and dissipates most of the heat into ambient air. |
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