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FD0250F Datasheet(PDF) 3 Page - Feeling Technology Corp. |
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FD0250F Datasheet(HTML) 3 Page - Feeling Technology Corp. |
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3 / 11 page ![]() FD0250f Rev1.2 June. 16, 2009 P.3 FEELING TECHNOLOGY Absolute Maximum Ratings Parameter Symbol Conditions Values Unit min. typ. max. Operating Temperature TOP - -20 105 ℃ Storage Temperature TST - -40 150 ℃ DC Supply Voltage(VDD ,RD) VDD - 6.5 V PWM Voltage Range PWMHIGH - 6.5 V PWMLOW - 0 V Supply Current IDD - 3 mA Continuous Current ICONT - 500 mA Hold current IHOLD - 800 mA RD sink current ISINK - 25 mA Junction Temperature TJ - 170 ℃ Maximum Power Dissipation PDTS826 - 520 mW Thermal resistance (note1) θja TS826 0.278 ℃ /mW Thermal resistance (note1) θjc TS826 0.018 ℃ /mW Magnetic Flux Density B Unlimited Gauss IR-Reflow Lead Temperature TP 10sec 260 ℃ Note1: device mounted with copper area of approximately 10mm 2, 1ØZ, no air flow. (room temperature: 25 ℃) Figure.3 Figure.4 255 ± 5 oC 10 ± 1 sec 150 ± 10 oC 90 ± 30 sec 2~5 oC /sec 2~5 oC /sec SECOND IR-ReFlow Soldering Condition 0 25 50 75 100 125 150 340 430 520 Pd (mW) Temp. ( ) o C TS826 Power Dissipation Curve 175 250 160 70 0 105 oC 170 oC |
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