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TD9516 Datasheet(PDF) 14 Page - TECHCODE SEMICONDUCTOR, INC. |
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TD9516 Datasheet(HTML) 14 Page - TECHCODE SEMICONDUCTOR, INC. |
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14 / 16 page ![]() October, 20, 2011. Techcode Semiconductor Limited www.techcodesemi.com 14 Techcode® USB Power-Distribution Switches TD9516/TD9517/TD9518/TD9519 DATASHEET Application Information Input Capacitor A 1F ceramic bypass capacitor from VIN to GND, located near the TD951X, is strongly recommended to suppress the ringing during short circuit fault event. Without the bypass capacitor, the output short may cause sufficient ringing on the input (from supply lead inductance) to damage internal control circuitry. Output Capacitor A low-ESR 10F aluminum electrolytic or tantalum between VOUT and GND is strongly recommended to reduce the voltage drop during hot-attachment of downstream peripheral. (Per USB 2.0, output ports must have a minimum 120F of low-ESR bulk capacitance per hub). Higher-value output capacitor is better when the output load is heavy. Additionally, bypassing the output with a 0.1F ceramic capacitor improves the immunity of the device to short-circuit transients. Layout Consideration The PCB layout should be carefully performed to maximize thermal dissipation and to minimize voltage drop, droop and EMI. The following guidelines must be considered: 1. Please place the input capacitors near the VIN pin as close as possible. 2. Output decoupling capacitors for load must be placed near the load as close as possible for decoupling highfrequency ripples. 3. Locate TD951X and output capacitors near the load to reduce parasitic resistance and inductance for excellent load transient performance. 4. The negative pins of the input and output capacitors and the GND pin must be connected to the ground plane of the load. 5. Keep VIN and VOUTtraces as wide and short as possible. |
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