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EXAMPLE BOARD LAYOUT

12X (

)

0.23

(0.5) TYP

(0.5) TYP

(

)

METAL

0.23

0.05 MAX

SOLDER MASK

OPENING

METAL UNDER

SOLDER MASK

(

)

SOLDER MASK

OPENING

0.23

0.05 MIN

4222640/A 12/2015

DSBGA - 0.4 mm max height

YPH0012

DIE SIZE BALL GRID ARRAY

NOTES: (continued)

4. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.

For more information, see Texas Instruments literature number SNVA009 (www.ti.com/lit/snva009).

D

SYMM

SYMM

LAND PATTERN EXAMPLE

SCALE:30X

1

2

A

B

C

3

NON-SOLDER MASK

DEFINED

(PREFERRED)

SOLDER MASK DETAILS

NOT TO SCALE

SOLDER MASK

DEFINED