AM186ED-20KCSLASHW datasheet(51/88 Pages) AMD

51 / 88 page

Am186ED/EDLV Microcontrollers

PRELI M INARY

F T

THERMAL CHARACTERISTICS

TQFP Package

Th e Am 186ED microcontroller is sp ecifie d for

operation with case temperature ranges from 0

°C to

+100

°C for a commercial device. Case temperature is

measured at the top center of the package as shown in

Figure 13. The various temperatures and thermal

resistances can be determined using the equations in

Figure 14 with information given in Table 11.

The total thermal resistance is

JA; θJA is the sum of

JC, the internal thermal resistance of the assembly,

and

CA, the case to ambient thermal resistance.

The variable

P is power in watts. Power supply current

(ICC) is in mA per MHz of clock frequency.

Figure 13.

Thermal Resistance(

°C/Watt)

Figure 14.

Thermal Characteristics Equations

Table 11.

Thermal Characteristics (

°C/Watt)

JA = θJC + θCA

Package/Board

Airflow

(Linear Feet

per Minute)

PQFP/2-Layer

0 fpm

200 fpm

400 fpm

600 fpm

TQFP/2-Layer

0 fpm

200 fpm

461036

400 fpm

401030

600 fpm

381028

PQFP/4-Layer

to 6-Layer

0 fpm

23518

200 fpm

400 fpm

600 fpm

TQFP/4-Layer

to 6-Layer

0 fpm

30624

200 fpm

400 fpm

600 fpm

JA = θJC + θCA

P=ICC

⋅ freq (MHz) ⋅ V

TJ=TC+( P

⋅θ

JC )

TJ=TA+ ( P

⋅θ

JA )

TC=TJ–( P

⋅θ

JC )

TC=TA+( P

⋅θ

CA )

TA=TJ–( P

⋅θ

JA )

TA=TC–( P

⋅θ

CA )

AM186ED-20KC/W Datasheet(PDF) 51 Page - Advanced Micro Devices

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