TUSB8043AI datasheet(9/56 Pages) TI1

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TUSB8043A

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SLLSF94 – JUNE 2019

Product Folder Links: TUSB8043A

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(1)

Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply Voltage

Range

VDD Supply voltage range

-0.3

1.4

VDD33 Supply voltage range

-0.3

3.8

Voltager Range

USB_SSRXP_UP, USB_SSRXN_UP, SSRXP_DN[4:1],

USB_RXN_DP[4:1] and USB_VBUS terminals

-0.3

1,4

XI terminal

-0.3

2.45

All other terminals

-0.3

3.8

Tstg

Storage temperature

-65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human body model (HBM), per

ANSI/ESDA/JEDEC JS-001, all pins(1)

±2000

Charged device model (CDM), per JEDEC

specification JESD22-C101, all pins(2)

±500

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VDD

1.1V Supply voltage

0.99

1.1

1.26

VDD33

3.3V Supply voltage

3.0

3.3

3.6

USB_VBU

Voltage at USB_VBUS terminal.

1.155

TUSB8043A Ambient temperature

°C

TUSB8043AI Ambient temperature

-40

°C

Junction temperature

-40

105

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

7.4 Thermal Information

THERMAL METRIC(1)

TUSB8043A

UNIT

RGC

64 PINS

RθJA

Junction-to-ambient thermal resistance

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

11.5

°C/W

RθJB

Junction-to-board thermal resistance

5.3

°C/W

ΨJT

Junction-to-top characterization parameter

0.2

°C/W

ΨJB

Junction-to-board characterization parameter

5.2

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

1.0

°C/W

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