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LM317LD Datasheet(PDF) 2 Page - ON Semiconductor |
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LM317LD Datasheet(HTML) 2 Page - ON Semiconductor |
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2 / 12 page ![]() LM317L 2 MOTOROLA ANALOG IC DEVICE DATA MAXIMUM RATINGS Rating Symbol Value Unit Input–Output Voltage Differential VI–VO 40 Vdc Power Dissipation PD Internally Limited W Operating Junction Temperature Range TJ –40 to +125 °C Storage Temperature Range Tstg –65 to +150 °C ELECTRICAL CHARACTERISTICS (VI–VO = 5.0 V; IO = 40 mA; TJ = Tlow to Thigh [Note 1]; Imax and Pmax [Note 2]; unless otherwise noted.) LM317L, LB Characteristics Figure Symbol Min Typ Max Unit Line Regulation (Note 3) TA = 25°C, 3.0 V ≤ VI – VO ≤ 40 V 1 Regline – 0.01 0.04 %/V Load Regulation (Note 3), TA = 25°C 10 mA ≤ IO ≤ Imax – LM317L VO ≤ 5.0 V VO ≥ 5.0 V 2 Regload – – 5.0 0.1 25 0.5 mV % VO Adjustment Pin Current 3 IAdj – 50 100 µA Adjustment Pin Current Change 2.5 V ≤ VI – VO ≤ 40 V, PD ≤ Pmax 10 mA ≤ IO ≤ Imax – LM317L 1, 2 ∆IAdj – 0.2 5.0 µA Reference Voltage 3.0 V ≤ VI – VO ≤ 40 V, PD ≤ Pmax 10 mA ≤ IO ≤ Imax – LM317L 3 Vref 1.20 1.25 1.30 V Line Regulation (Note 3) 3.0 V ≤ VI – VO ≤ 40 V 1 Regline – 0.02 0.07 %/V Load Regulation (Note 3) 10 mA ≤ IO ≤ Imax – LM317L VO ≤ 5.0 V VO ≥ 5.0 V 2 Regload – – 20 0.3 70 1.5 mV % VO Temperature Stability (Tlow ≤ TJ ≤ Thigh) 3 TS – 0.7 – % VO Minimum Load Current to Maintain Regulation (VI – VO = 40 V) 3 ILmin – 3.5 10 mA Maximum Output Current VI – VO ≤ 6.25 V, PD ≤ Pmax, Z Package VI – VO ≤ 40 V, PD ≤ Pmax, TA = 25°C, Z Package 3 Imax 100 – 200 20 – – mA RMS Noise, % of VO TA = 25°C, 10 Hz ≤ f ≤ 10 kHz N – 0.003 – % VO Ripple Rejection (Note 4) VO = 1.2 V, f = 120 Hz CAdj = 10 µF, VO = 10.0 V 4 RR 60 – 80 80 – – dB Long Term Stability, TJ = Thigh (Note 5) TA = 25°C for Endpoint Measurements 3 S – 0.3 1.0 %/1.0 k Hrs. Thermal Resistance, Junction–to–Case Z Package R θJC – 83 – °C/W Thermal Resistance, Junction–to–Air Z Package R θJA – 160 – °C/W NOTES: 1. Tlow to Thigh = 0° to +125°C for LM317L –40 ° to +125°C for LM317LB 2. Imax = 100 mA Pmax = 625 mW 3. Load and line regulation are specified at constant junction temperature. Changes in VO due to heating effects must be taken into account separately. Pulse testing with low duty cycle is used. 4. CAdj, when used, is connected between the adjustment pin and ground. 5. Since Long–Term Stability cannot be measured on each device before shipment, this specification is an engineering estimate of average stability from lot to lot. |
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