TAI-TECH

5. Specification

6. Material List

NO

Items

Materials

1

Core

Alloy Powder .

2

Wire

Polyester Wire or equivalent.

3

Clip

100% Pb free solder(Ni+Sn---Plating)

4

Ink

Halogen-free ketone

NO

Items

Materials

1

Core

Alloy Powder .

2

Wire

Polyester Wire or equivalent.

3

Solder

100% Pb free solder

4

Ink

Halogen-free ketone

Part Number

Inductance

L0 A(uH) ±20%

Heat Rating

Current DC

Irms ( A )

Saturation

Current DC

I sat (

A)

DCR

(mΩ)

E(mm)

Type

Typ

Max

Typ

Max

Typ

Max

TMPA1003S-R22MN-D

0.22

33

30

50

45

0.9

1.0

2.7±0.35

non-leadframe

TMPA1003S-R36MN-D

0.36

28

25

40

35

1.25

1.4

2.7±0.35

non-leadframe

TMPA1003S-R47MN-D

0.47

26

23

36

32

1.8

2.2

non-leadframe

TMPA1003S-R82MN-D

0.82

20

18

28

25

3.1

3.7

3.0±0.3

leadframe

TMPA1003S-2R2MN-D

2.20

14

12

18

16

7.8

8.8

3.0±0.3

leadframe

TMPA1003S-8R2MN-D

8.20

7.2

6.5

7.2

6.8

32

38

3.0±0.3

leadframe

Note:

2. All test data referenced to 25℃ ambient.

3. Testing Instrument(or equ) : L: HP4284A,CH11025,CH3302,CH1320,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER.

4. Heat Rated Current (Irms) will cause the coil temperature rise approximately ΔT of 40℃

6. The part temperature (ambient + temp rise) should not exceed 125℃under worst case operating conditions.Circuit design,component,PCB trace size and

thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.

7. Special inquiries besides the above common used types can be met on your requirement.

4

3

2

1

4

3

2

1