TAI-TECH

P3

5. Specification

6. Material List

NO

Items

Materials

1

Core

Carbonyl Powder.

2

Wire

Polyester Wire or equivalent.

3

Clip

100% Pb free solder(Ni+Sn---Plating)

4

paint

Epoxy resin

5

Ink

Halogen-free ketone

Part Number

Inductance

L0 (uH)±20%

I rms ( A )

Typ

I sat ( A )

Typ

DCR(mΩ)

Typ.@25℃

DCR(mΩ)

Max.@25℃

TMPC0315H-R22MG

0.22

7.0

10.8

14

17

TMPC0315H-R47MG

0.47

5.5

8.0

23.3

28

TMPC0315H-R56MG

0.56

5.0

7.2

28

33

TMPC0315H-R68MG

0.68

4.5

6.5

34

42

TMPC0315H-1R0MG

1.00

3.6

5.8

41

50

TMPC0315H-1R5MG

1.50

3.4

4.0

64

77

TMPC0315H-2R2MG

2.20

3.2

3.8

82

98

TMPC0315H-3R3MG

3.30

2.5

3.2

170

205

TMPC0315H-4R7MG

4.70

1.9

2.8

220

264

TMPC0315H-5R6MG

5.60

1.7

2.3

265

318

TMPC0315H-6R8MG

6.80

1.5

2.0

290

348

TMPC0315H-8R2MG

8.20

1.3

1.8

390

468

TMPC0315H-100MG

10.0

1.2

1.6

435

522

2. All test data referenced to 25℃ ambient.

3. Testing Instrument(or equ) : L: HP4284A,CH11025,CH3302,CH1320,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER.

4. Heat Rated Current (Irms) will cause the coil temperature rise approximately ΔT of 40℃

6. The part temperature (ambient + temp rise) should not exceed 125℃under worst case operating conditions.Circuit design,component,PCB trace size and

thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.

7. Special inquiries besides the above common used types can be met on your requirement.

4

3

2

1

5