3

Bulletin I2203 03/05

www.irf.com

T

J

Max. Junction Temperature Range

- 40 to 150

°C

T

stg

Max. Storage Temperature Range

- 40 to 150

°C

SolderingTemperature

240

°C

for 10 seconds

R

2.5

°C/W

DCoperation

to Case

R

50

°C/W

to Ambient (PCB Mount)**

wt

Approximate Weight

1(0.03)

g(oz.)

T

CaseStyle

TO-252AA (D-Pak)

MarkingDevice

8EWF12S

Thermal-Mechanical Specifications

Parameters

8EWF

Units

Conditions

For recommended footprint and soldering techniques refer to application note #AN-994

Fig. 1 - Current Rating Characteristics

Fig. 3 - Forward Power Loss Characteristics

Fig. 4 - Forward Power Loss Characteristics

Fig. 2 - Current Rating Characteristics

60

70

80

90

100

110

120

130

140

150

0

1

2345678

9

30°

60°

90°

120°

180°

Conduction Angle

Average Forward Current (A)

8EWF..SSeries

R

(DC) = 2.5 °C/ W

thJC

60

70

80

90

100

110

120

130

140

150

024

68

10

12

14

DC

30° 60°

90°

120°

180°

Cond uction Period

Average Forward Current (A)

8EWF..SSeries

R

(DC) = 2.5 °C/ W

thJC

0

2

4

6

8

10

12

012

3456789

RMSLimit

180°

120°

90°

60°

30°

Cond uction Angle

Average Forward Current (A)

8EWF..SSeries

T = 150°C

J

0

2

4

6

8

10

12

14

16

18

02

46

8

10

12

14

DC

180°

120°

90°

60°

30°

RMSLimit

Conduction Period

Average Forward Current (A)

8EWF..SSeries

T = 150°C

J