TS39100CP1.5 datasheet(3/10 Pages) TSC

3 / 10 page

TS39100/1/2/3

3-10

2004/06 rev. E

Thermal Performance

Condition

Package type

Typ

Unit

SOT-223

SOP-8

Thermal Resistance

Junction to Ambient

TO-252

oC/W

Note 1: Absolute Maximum Rating is limits beyond which damage to the device may occur. For guaranteed

specifications and test conditions see the Electrical Characteristics.

Note 2: The device is not guaranteed to operate outside its operating rating.

Note 3: Devices are ESD sensitive. Handling precautions recommended.

Note 4: The maximum allowable power dissipation is a function of the maximum junction temperature, Tj, the junction to

ambient thermal resistance, θja, and the ambient temperature, Ta. Exceeding the maximum allowable power

dissipation will cause excessive die temperature, and the regulator will go into thermal shutdown. The effective

value of θja can be reduced by using a heatsink, Pd(max) = (Tj(max) – Ta) / Θja.

Note 5: Dropout voltage is defined as the input to output differential at which the output voltage drops -1% below its

nominal value measured at 1V differential.

Note 6: Ground pin current is the regulator quiescent current. The total current drawn from the source is the sum of the

ground pin current and output load current, Iin = Ignd + Iout.

Note 7: Vref

≤ Vout ≤ (Vin – 1V), 2.25V ≤ Vin ≤ 16V, 10mA ≤ IL ≤ 1.0A.

Note 8: Output voltage temperature coefficient is ∆Vout (worse cast) / (Tj(max) - Tj(min)) where is Tj(max) +125

oC and

Tj(min) is 0

oC.

Note 9: For adjustable device and fiexed device with Vout > 2.25V.

Block Diagram

TS39100

TS39100CP1.5 Datasheet(PDF) 3 Page - Taiwan Semiconductor Company, Ltd