MKP385e

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Vishay BCcomponents

Revision: 28-May-2019

27

Document Number: 28255

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

AUTOMOTIVE AEC-Q200, REVISION D QUALIFICATION

STRESS

REVISION

CONDITION

SAMPLE

SIZE

PERFORMANCE REQUIREMENTS

1.

High

temperature



exposure

(storage)

D

Test as per MIL-STD 202, method 108



Temp.: 105 ºC; unpowered



Duration: 1000 h

77

|

C/C|  5 %

 0.0005 for C  100 nF at 100 kHz

 0.0010 for 100 nF < C  470 nF at 100 kHz

 0.0015 for 470 nF < C  1 μF at 100 kHz

 0.0015 for 1 μF < C  10 μF at 10 kHz

IR > 50 % of initial specified value

2.

Temperature



cycling

D

Test as per JESD22, method JA-104



Total no. of cycles: 1000 cycles



Lower temp.: -40 °C



Upper temp: +105 °C



Dwell each 30 min as per rev. D

77

|

C/C|  5 %

Increase of tan

:

 0.0005 for C  100 nF at 100 kHz

 0.0010 for 100 nF < C  470 nF at 100 kHz

 0.0015 for 470 nF < C  1 μF at 100 kHz

 0.0015 for 1 μF < C  10 μF at 10 kHz

IR > 50 % of initial specified value

3.

Moisture



resistance

D

Test as per MIL-STD 202, method 106



10 cycles at 24 h/cycle



unpowered

77

|

C/C|  5 %

Increase of tan

:

 0.0005 for C  100 nF at 100 kHz

 0.0010 for 100 nF < C  470 nF at 100 kHz

 0.0015 for 470 nF < C  1 μF at 100 kHz

 0.0015 for 1 μF < C  10 μF at 10 kHz

IR > 50 % of initial specified value

4.

Biased



humidity AC

D

Test as per MIL-STD 202, method 103



Duration: 1000 h

77

|

C/C|  5 %

Increase of tan

:  0.008 at 1 kHz

IR > 50 % of initial specified value

5.

Biased



humidity DC

D

Test as per MIL-STD 202, method 103



Duration: 1000 h

77

|

C/C|  5 %

Increase of tan

:  0.008 at 1 kHz

IR > 50 % of initial specified value

6.

Operational



life AC

D

Test as per MIL-STD 202, method 108



Duration: 1000 h

77

|

C/C|  5 %

Increase of tan

:

 0.0005 for C  100 nF at 100 kHz

 0.0010 for 100 nF < C  470 nF at 100 kHz

 0.0015 for 470 nF < C  1 μF at 100 kHz

 0.0015 for 1 μF < C  10 μF at 10 kHz

IR > 50 % of initial specified value

7.

Operational



life DC

D

Test as per MIL-STD 202, method 108



Duration: 1000 h

77

|

C/C|  5 %

Increase of tan

:

 0.0005 for C  100 nF at 100 kHz

 0.0010 for 100 nF < C  470 nF at 100 kHz

 0.0015 for 470 nF < C  1 μF at 100 kHz

 0.0015 for 1 μF < C  10 μF at 10 kHz

IR > 50 % of initial specified value

8.

Terminal

strength (leaded)

D

Test as per MIL-STD 202, method 211



Test leaded device lead integrity only.



- A (pull-test): 2.27 kg (10 s)



- C (wire-lead bend test): 227 g (3 x 3 s)

30

No visual damage

9.

Resistance



to solvents

D

MIL-STD-202 method 215



- Also aqueous chemical



- OKEM clean or equivalent.



Do not use banned solvents.

5

No visual damage



Legible marking

10. Mechanical



shock

D

MIL-STD-202 method 213



100 g's; 6 ms;



half sine; 3.75 m/s

30

No visual damage

11. Vibration

D

MIL-STD-202 method 204



5 g's for 20 min



12 cycles x 3 directions



10 Hz to 2000 Hz

30

No visual damage

12. Resistance to



soldering heat

D

MIL-STD-202 method 210



Temp.: 280 °C; time: 10 s



solder within 1.5 mm of device body

30

|

C/C|  5 %

Increase of tan

:

 0.0005 for C  100 nF at 100 kHz

 0.0010 for 100 nF < C  470 nF at 100 kHz

 0.0015 for 470 nF < C  1 μF at 100 kHz

 0.0015 for 1 μF < C  10 μF at 10 kHz

IR > 50 % of initial specified value

13. Solderability

D

J-STD-002



Leaded: method A at 235 °C,



category 3 (245 °C / 3 s)

15

Good tinning as evidence by free flowing of the



solder with wetting of terminations > 95 %

14. Flammability

D

UL-94



One flame application



Class B

15

V-0 is acceptable.



Class B or C according IEC is also acceptable