MKP385e

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Vishay BCcomponents

Revision: 28-May-2019

20

Document Number: 28255

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

POWER DISSIPATION AND MAXIMUM COMPONENT TEMPERATURE RISE

The power dissipation must be limited in order not to exceed the maximum allowed component temperature rise as a function

of the free air ambient temperature.





The component temperature rise (

T) can be measured (see section “Measuring the component temperature” for more details)

or calculated by

T = P/G:

•

T = component temperature rise (°C)

• P = power dissipation of the component (mW)

• G = heat conductivity of the component (mW/°C)

MEASURING THE COMPONENT TEMPERATURE

A thermocouple must be attached to the capacitor body as in:

The temperature rise is given by

T = T

To avoid radiation or convection, the capacitor should be tested in a wind-free box.

HEAT CONDUCTIVITY (G) AS A FUNCTION OF ORIGINAL PITCH AND CAPACITOR BODY

THICKNESS IN mW/°C

(mm)

HEAT CONDUCTIVITY (mW/°C)

PITCH 15 mm

PITCH 22.5 mm

PITCH 27.5 mm

PITCH 37.5 mm

PITCH 52.5 mm

3.0

-

---

-

3.5

-

---

-

4.0

-

---

-

4.5

-

---

-

5.0

-

---

-

6.0

-

---

-

7.0

14

17

-

-

-

8.5

16

20

-

-

-

9.0

19

-

21

-

-

10.0

21

23

-

-

-

11.0

22

-

-

-

-

12.0

-

-

24

-

-

13.0

-

28

-

-

-

15.0

-

29

-

-

-

15.7

-

-

-

46

-

18.0

-

-

28

54

-

18.5

-

-

32

60

-

21.0

-

-

39

-

-

21.5

-

-

-

68

-

24.0

-

-

45

78

-

25.0

-

-

-

-

-

30.0

-

-

-

90

-

35.0

-

-

-

-

133

Thermocouple

CBA758