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STM32H747AI Datasheet(PDF) 230 Page - STMicroelectronics

Part # STM32H747AI
Description  Dual 32-bit Arm® Cortex®-M7 up to 480MHz and -M4 MCUs, up to 2MB Flash, 1MB RAM, 46 com. and analog interfaces, SMPS, DSI
PDF  252 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32H747AI Datasheet(HTML) 230 Page - STMicroelectronics

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Electrical characteristics
STM32H747xI/G
220/242
DS12930 Rev 1
Figure 69. Ethernet MII timing diagram
JTAG/SWD interface characteristics
Unless otherwise specified, the parameters given in Table 129 and Table 130 for
JTAG/SWD are derived from tests performed under the ambient temperature, frcc_c_ck
frequency and VDD supply voltage summarized in Table 22: General operating conditions,
with the following configuration:
•
Output speed is set to OSPEEDRy[1:0] = 0x10
•
Capacitive load CL=30 pF
•
Measurement points are done at CMOS levels: 0.5VDD
•
VOS level set to VOS1
Refer to Section 6.3.18: I/O port characteristics for more details on the input/output
characteristics:
Table 129. Dynamics JTAG characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Fpp
TCK clock frequency
2.7V <VDD< 3.6 V
-
-
37
MHz
1/tc(TCK)
1.62 <VDD< 3.6 V
-
-
27.5
tisu(TMS)
TMS input setup time
-
2.5
-
-
tih(TMS)
TMS input hold time
-
1
-
-
tisu(TDI)
TDI input setup time
-
1.5
-
-
-
tih(TDI)
TDI input hold time
-
1
-
-
-
tov(TDO)
TDO output valid time
2.7V <VDD< 3.6 V
-
8
13.5
-
1.62 <VDD< 3.6 V
-
8
18
-
toh(TDO)
TDO output hold time
-
7
-
-
-
ai15668b
MII_RX_CLK
MII_RXD[3:0]
MII_RX_DV
MII_RX_ER
td(TXEN)
td(TXD)
tsu(RXD)
tsu(ER)
tsu(DV)
tih(RXD)
tih(ER)
tih(DV)
MII_TX_CLK
MII_TX_EN
MII_TXD[3:0]



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