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STM32H747AI Datasheet(PDF) 233 Page - STMicroelectronics |
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STM32H747AI Datasheet(HTML) 233 Page - STMicroelectronics |
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233 / 252 page ![]() DS12930 Rev 1 223/242 STM32H747xI/G Package information 240 Figure 73. WLCSP156 bump recommended footprint 1. Dimensions are expressed in millimeters. Table 131. WLCSP156 package mechanical data Symbol millimeters inches(1) 1. Values in inches are converted from mm and rounded to the 3rd decimal digits. Min Typ Max Min Typ Max A- - 0.58 - - 0.023 A1 - 0.17 - - 0.006 - A2 - 0.38 - - 0.015 - A3 - 0.025(2) 2. Back side coating. Nominal dimension rounded to the 3rd decimal place resulting from process capability. -- 0.001 - b 0.21 0.24 0.27 0.008 0.009 0.011 D 4.94 4.96 4.98 0.193 0.195 0.196 E 4.62 4.64 4.66 0.181 0.182 0.183 e1 - 4.20 - - 0.014 - e2 - 3.85 - - 0.165 - e - 0.35 - - 0.152 - F - 0.380(3) 3. Calculated dimensions are rounded to 3rd decimal place. -- 0.015 - G - 0.395(3) -- 0.015 - aaa - - 0.10 - - 0.004 bbb - - 0.10 - - 0.004 ccc - - 0.10 - - 0.004 ddd - - 0.05 - - 0.002 eee - - 0.05 - - 0.002 A086_WLCSP156_FP_V1 Dpad Dsm |
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