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STM32H747AI Datasheet(PDF) 235 Page - STMicroelectronics |
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STM32H747AI Datasheet(HTML) 235 Page - STMicroelectronics |
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235 / 252 page ![]() DS12930 Rev 1 225/242 STM32H747xI/G Package information 240 7.2 UFBGA169 package information UFBGA169 is a 169-pin, 7 x 7 mm, 0.50 mm pitch, ultra fine pitch ball grid array package. Figure 75. UFBGA169 package outline 1. Drawing is not in scale. Table 133. UFBGA169 package mechanical data Symbol millimeters inches(1) Min. Typ. Max. Min. Typ. Max. A 0.460 0.530 0.600 0.0181 0.0209 0.0236 A1 0.050 0.080 0.110 0.0020 0.0031 0.0043 A2 0.400 0.450 0.500 0.0157 0.0177 0.0197 A3 - 0.130 - - 0.0051 - A4 0.270 0.320 0.370 0.0106 0.0126 0.0146 b 0.230 0.280 0.330 0.0091 0.0110 0.0130 D 6.950 7.000 7.050 0.2736 0.2756 0.2776 D1 5.950 6.000 6.050 0.2343 0.2362 0.2382 E 6.950 7.000 7.050 0.2736 0.2756 0.2776 E1 5.950 6.000 6.050 0.2343 0.2362 0.2382 e - 0.500 - - 0.0197 - F 0.450 0.500 0.550 0.0177 0.0197 0.0217 A0YV_ME_V2 Seating plane A2 A1 A e F F e N A BOTTOM VIEW E D TOP VIEW Øb (169 balls) Y X Y eee Ø M fff Ø M Z Z X A1 ball identifier A1 ball index area b D1 E1 A4 A3 13 1 Z Z ddd SIDE VIEW |
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