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STM32H747AI Datasheet(PDF) 245 Page - STMicroelectronics |
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STM32H747AI Datasheet(HTML) 245 Page - STMicroelectronics |
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245 / 252 page ![]() DS12930 Rev 1 235/242 STM32H747xI/G Package information 240 7.5 TFBGA240+25 package information TFBGA240+25 is a 265 ball, 14x14 mm, 0.8 mm pitch, fine pitch ball grid array package. Figure 83. TFBGA240+25 package outline 1. Dimensions are expressed in millimeters. C SEATING PLANE D1 F D e A S 17 1 b (240 + 25 balls) BOTTOM VIEW e A1 ball identifier TOP VIEW A07U_ME_V1 |
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