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STM32H747AI Datasheet(PDF) 248 Page - STMicroelectronics |
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STM32H747AI Datasheet(HTML) 248 Page - STMicroelectronics |
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248 / 252 page  Package information STM32H747xI/G 238/242 DS12930 Rev 1 7.6 Thermal characteristics The maximum chip-junction temperature, TJ max, in degrees Celsius, may be calculated using the following equation: TJ max = TA max + (PD max × ΘJA) Where: • TA max is the maximum ambient temperature in ° C, •ΘJA is the package junction-to-ambient thermal resistance, in ° C/W, • PD max is the sum of PINT max and PI/O max (PD max = PINT max + PI/Omax), • PINT max is the product of IDD and VDD, expressed in Watts. This is the maximum chip internal power. PI/O max represents the maximum power dissipation on output pins where: PI/O max = Σ (VOL × IOL) + Σ((VDD – VOH) × IOH), taking into account the actual VOL / IOL and VOH / IOH of the I/Os at low and high level in the application. Table 138. Thermal characteristics Symbol Definition Parameter Value Unit ΘJA Thermal resistance junction-ambient Thermal resistance junction-ambient WLCSP156 - 4.96 x 4.64 mm /0.35 mm pitch 35 °C/W Thermal resistance junction-ambient UFBGA169 - 7 x 7 mm /0.5 mm pitch 37.7 Thermal resistance junction-ambient LQFP176 - 24 x 24 mm /0.5 mm pitch 43.0 Thermal resistance junction-ambient LQFP208 - 28 x 28 mm /0.5 mm pitch 42.4 Thermal resistance junction-ambient TFBGA240+25 - 14 x 14 mm / 0.8 mm pitch 36.6 ΘJB Thermal resistance junction-board Thermal resistance junction-ambient WLCSP156 - 4.96 x 4.64 mm /0.35 mm pitch 18.1 °C/W Thermal resistance junction-ambient UFBGA169 - 7 x 7 mm /0.5 mm pitch 17.3 Thermal resistance junction-ambient LQFP176 - 24 x 24 mm /0.5 mm pitch 39.4 Thermal resistance junction-ambient LQFP208 - 28 x 28 mm /0.5 mm pitch 40.3 Thermal resistance junction-ambient TFBGA240+25 - 14 x 14 mm / 0.8 mm pitch 24.3 |
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