STM32L021D4 datasheet(113/114 Pages) STMICROELECTRONICS

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DocID027982 Rev 5

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STM32L021x4

Revision history

113

12-Sep-2017

5 (continued)

In Section 7: Package information:

– Added paragraph related to optional marking or

inset/upset marks in all device marking sections.

– Updated Table 66: LQFP32 - 32-pin, 7 x 7 mm, 32-pin

low-profile quad flat package mechanical data.

– Updated Figure 34: UFQFPN32 - 32-pin, 5x5 mm,

0.5 mm pitch ultra thin fine pitch quad flat package

outline and Table 67: UFQFPN32 - 32-pin, 5x5 mm,

0.5 mm pitch ultra thin fine pitch quad flat package

mechanical data.

– Updated Figure 39: UFQFPN20 - 20-lead, 3x3 mm,

0.5 mm pitch, ultra thin fine pitch quad flat package

outline and Table 70: UFQFPN20 - 20-lead, 3x3 mm,

0.5 mm pitch, ultra thin fine pitch quad flat package

mechanical data.

– Added notes related to D and E1 in Table 71:

TSSOP20 – 20-lead thin shrink small outline, 6.5 x

4.4 mm, 0.65 mm pitch, package mechanical data.

– Updated Figure 44: TSSOP14 – 14-lead thin shrink

small outline, 5.0 x 4.4 mm, 0.65 mm pitch, package

outline and Table 71: TSSOP20 – 20-lead thin shrink

small outline, 6.5 x 4.4 mm, 0.65 mm pitch, package

mechanical data

– Added notes related to D and E1 in Table 71:

TSSOP20 – 20-lead thin shrink small outline, 6.5 x

4.4 mm, 0.65 mm pitch, package mechanical data.

Section 8 renamed into Ordering information.

Table 75. Document revision history

Date

Revision

Changes

STM32L021D4 Datasheet(PDF) 113 Page - STMicroelectronics