Structural Adhesive Film AF 191

Technical Datasheet

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Storage

Storage Stability – Storage at 0°F (-18°C) or below is recommended for Scotch-Weld

AF 191 Film to obtain maximum storage life.

Cure Cycle

A cure of 60 minutes at 350°F and 45 ± 5 psi positive pressure is suggested when

maximum performance is desired.

Cure Cycle (Autoclave or Platen Press)

The following cure cycle has been used to obtain dense glue lines.

Cure Cycle (Autoclave, Vacuum Bag, or Platen Press)

1. Apply vacuum or pressure to keep assembled parts in place.

2. If using autoclave: Apply positive pressure slowly until 14 psi positive pressure is

applied. Once reached, dump vacuum bag.

3. If using vacuum bag only, limit vacuum to

5-10 inches of mercury. This is necessary

Recommended

to prevent frothing in the bondline.

Cure Cycle

4. Increase bondline temperature rise rate.

4-5°F/min.

5. Increase bonding pressure.

45 ± 5 psi

6. Cure.

350 ± 10°F

7. Cool.

5-10°F/min.

8. Decrease pressure when temperature is below 200°F.

3M™ Scotch-Weld™ Structural Adhesive Film AF 191 Low Temperature

Cure Data

OLS (psi) at

Bell Peel

Test Temperature

at

Cure Cycle

-67°F

72°F

250°F

300°F

350°F

75°F

1 hr, 350°F, 45 psi

4217

5285

–

3613

2833

35 piw

1 hr, 300°F, 45 psi

1767

5357

–

1133

857

55 piw

90 min., 300°F, 25 psi

2510

5480

2490

–

–

39 piw

2 hr, 300°F, 45 psi

4200

5636

–

2873

2003

50 piw

2 hr, 275°F, 45 psi

1767

5163

–

1093

613

67 piw

3 hr, 275°F, 45 psi

3533

5793

–

2243

1207

51 piw

Shelf Life

Standard shelf life of Scotch-Weld AF 191 Film at 0°F (-18°C) is 6 months from

date of shipment.

Note: Scotch-Weld AF 191 Film should be permitted to thoroughly warm to room

temperature before being used in order to prevent moisture condensation.

(Do not open protective container prior to reaching ambient conditions).