T1035-6G datasheet(5/12 Pages) STMICROELECTRONICS

Part #	T1035-6G

Description	10 A Snubberless™ logic level and standard Triacs

PDF	12 Pages

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Manufacturer	STMICROELECTRONICS [STMicroelectronics]

Direct Link	http://www.st.com

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Figure 8. Relative variation of gate trigger current, holding

current and latching current versus junction temperature

(typical values)

-40

-20

100

120

140

0.0

0.5

1.0

1.5

2.0

2.5

IGT,IH,IL[Tj] / IGT,IH,IL[Tj = 25 °C]

Tj (°C)

IH and IL

IGT

Figure 9. Relative variation of critical rate of decrease of

main current versus (dV/dt)c (typical values)

0.1

1.0

10.0

100.0

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

(dl/dt)c [(dV/dt)c / specified (dl/dt)c

(dV/dt)c (V/µs)

BW/CW/T10xx

Figure 10. Relative variation of critical rate of decrease of

main current versus junction temperature

100

125

(dl/dt)c [Tj] / (dl/dt)c [Tj = 125 °C]

Tj(°C)

Figure 11. D²PAK thermal resistance junction to ambient

versus copper surface under tab

Rth(j-a) (°C/W)

D²PAK

Epoxy printed board FR4, copper thickness = 35 µm

SCu(cm²)

BTA10, BTB10, T1035, T1050

Characteristics (curves)

DS3165 - Rev 9

page 5/12

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