MAXM17536 datasheet(2/22 Pages) MAXIM

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IN to PGND ...........................................................-0.3V to +65V

EN/UVLO, SS to SGND ........................................-0.3V to +65V

LX to PGND................................................-0.3V to (VIN + 0.3V)

BST to PGND........................................................-0.3V to +70V

BST to LX.............................................................-0.3V to +6.5V

BST to VCC ...........................................................-0.3V to +65V

FB, CF, RESET, MODE/SYNC, RT to SGND ......-0.3V to +6.5V

DL, VCC to PGND ................................................-0.3V to +6.5V

SGND to PGND....................................................-0.3V to +0.3V

EXTVCC to PGND ................................................-0.3V to +26V

OUT to PGND (VIN ≤ 16V).........................-0.3V to (VIN + 0.3V)

OUT to PGND (VIN > 16V)......................................-0.3V to 16V

Output Short-Circuit Duration....................................Continuous

Operating Temperature Range ........................ -40°C to +125°C

Junction Temperature (Note 1)........................................+150°C

Storage Temperature Range............................ -55°C to +150°C

Soldering Temperature (reflow).......................................+240°C

PACKAGE TYPE: 29-PIN SiP

Package Code

L29915#1

Outline Number

21-100177

Land Pattern Number

90-100055

Thermal Resistance, Four-Layer Board: (Note 2)

Junction to Ambient (θJA)

24°C/W

(VIN = VEN/UVLO = 24V, RRT = OPEN (450kHz), VPGND = VSGND = VMODE/SYNC = 0V, LX = SS = RESET = CF = DL = VCC = OUT =

open, VEXTVCC = 0V, VBST to VLX = 5V, VFB = 1V, TA = -40°C to +125°C, unless otherwise noted. Typical values are at TA = +25°C.

All voltages are referenced to SGND, unless otherwise noted.) (Note 3)

Note 1: Junction temperature greater than +125°C degrades operating lifetimes.

Note 2: Package thermal resistance is measured on an evaluation board with natural convection.

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

INPUT SUPPLY (VIN)

Input-Voltage Range

VIN

4.5

Input-Shutdown Current

IIN_SH

VEN/UVLO = 0V, (Shutdown mode)

μA

Input-Quiescent Current

IQ_PFM

MODE/SYNC = open

128

μA

IQ_DCM

DCM Mode

1.27

IQ_PWM

PWM Mode, no load, VOUT = VEXTVCC = 5V

ENABLE/UNDERVOLTAGE LOCKOUT (EN/UVLO)

EN/UVLO Threshold

VENR

VEN/UVLO rising

1.185

1.215

1.245

VENF

VEN/UVLO falling

1.06

1.09

1.12

Enable Pullup Resistor

RENP

Pullup resistor between IN and EN/UVLO pins

3.15

3.32

3.45

MΩ

Absolute Maximum Ratings

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these

or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect

device reliability.

For the latest package outline information and land patterns (footprints), go to

www.maximintegrated.com/packages. Note that a “+”,

“#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing

pertains to the package regardless of RoHS status.

Package Information

Electrical Characteristics

www.maximintegrated.com

Maxim Integrated │ 2

MAXM17536

4.5V to 60V, 4A High-Efficiency, DC-DC Step-Down

SiP Power Module with Integrated Inductor

MAXM17536 Datasheet(PDF) 2 Page - Maxim Integrated Products

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