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STSPIN32F0251Q Datasheet(PDF) 9 Page - STMicroelectronics |
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STSPIN32F0251Q Datasheet(HTML) 9 Page - STMicroelectronics |
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9 / 32 page ![]() 4.2 Thermal data Table 5. Thermal data Symbol Parameter Value Unit Rth(JA) Thermal resistance junction to ambient(1) TQFP 10x10 64L package 27.6 °C/W Thermal resistance junction to ambient (1) QFN 10x10 72L package 22.4 1. JEDEC 2s2p PCB in still air. 4.3 Recommended operating conditions Table 6. Recommended operating conditions Symbol Parameter Test Condition Min Typ Max Unit VCC Power supply voltage (VCCthON)MAX 20 V VLS (1) Low-side driver supply voltage 4 20 V VPS (2) Low-side driver ground -5 5 V VBO(3) Floating supply voltage (VBOthON)MAX 20 V VCIN Comparator input voltage 0 15 V VOUT DC Output voltage -10(4) 230 V FSW Maximum switching frequency (5) 800 kHz VDD Standard MCU operating voltage 3.0 3.3 3.6 V VDDA MCU analog operating voltage (ADC not used) Must have a potential equal to or higher than VDD VDD 3.6 V MCU analog operating voltage (ADC used) VDD 3.6 V TJ Operating junction temperature -40 125 °C 1. VLS = VCC - VPGND 2. VPS = VPGND - VSGND 3. VBO = VBOOT - VOUT 4. LVG off. VCC = 9 V. Logic is operational if VBOOT > 5 V 5. Actual maximum FSW depends on power dissipation. STSPIN32F0251, STSPIN32F0252 Thermal data DS13048 - Rev 4 page 9/32 |
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