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MCP660T-E/ML Datasheet(PDF) 29 Page - Microchip Technology |
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MCP660T-E/ML Datasheet(HTML) 29 Page - Microchip Technology |
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29 / 68 page ![]() 2009-2014 Microchip Technology Inc. DS20002194E-page 29 MCP660/1/2/3/4/5/9 6.0 PACKAGING INFORMATION 6.1 Package Marking Information XXNN XXNN Legend: XX...X Customer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code Pb-free JEDEC® designator for Matte Tin (Sn) * This package is Pb-free. The Pb-free JEDEC designator ( ) can be found on the outer packaging for this package. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 3 e 3 e 5-Lead SOT-23 (MCP661) Example YX25 6-Lead SOT-23 (MCP663) Example JE25 8-Lead TDFN (2x3x0.75 mm) (MCP661) Example ABJ 423 25 8-Lead DFN (3x3x0.9 mm) (MCP662) Example DABQ 1423 256 Device Code MCP662T-E/MF DABQ Note 1: Applies to 8-lead 3x3 DFN |
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