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ver 1.1 1018

Die Outline (all dimensions in microns)

Notes:

1. No connection required for unlabeled pads

2. Backside is RF and DC ground

3. Backside and bond pad metal: Gold

4. Die is 70 microns thick

5. DC bond pads (2, 3, 4, 6) are 100 x 100 microns

6. RF bond pads (1, 5) are 100 x 200 microns

Mechanical Information

CMD291

16-24 GHz Driver Amplifier

105.00

1945.00

2450.00

785.00

1570.00

892.50

1355.00

1945.00