Advanced Clock Drivers Devices

4

Freescale Semiconductor

MPC9239

Table 3. Function Table

Input

0

1

XTAL_SEL

XTAL interface

OE

Outputs enabled

PWR_DOWN

Output divider

÷ 1

Output divider

÷ 16

Table 4. General Specifications

Symbol

Characteristics

Min

Typ

Max

Unit

Condition

Output Termination Voltage

V

MM

ESD Protection (Machine Model)

200

V

HBM

ESD Protection (Human Body Model)

2000

V

LU

Latch-Up Immunity

200

mA

Input Capacitance

4.0

pF

Inputs

LQFP 32 Thermal Resistance Junction to Ambient

JESD 51-3, single layer test board

JESD 51-6, 2S2P multilayer test board

83.1

73.3

68.9

63.8

57.4

59.0

54.4

52.5

50.4

47.8

86.0

75.4

70.9

65.3

59.6

60.6

55.7

53.8

51.5

48.8

°C/W

°C/W

°C/W

°C/W

°C/W

°C/W

°C/W

°C/W

°C/W

°C/W

Natural convection

100 ft/min

200 ft/min

400 ft/min

800 ft/min

Natural convection

100 ft/min

200 ft/min

400 ft/min

800 ft/min

LQFP 32 Thermal Resistance Junction to Case

23.0

26.3

°C/W MIL-SPEC 883E

Method 1012.1

1. Absolute maximum continuous ratings are those maximum values beyond which damage to the device may occur. Exposure to these

conditions or conditions beyond those indicated may adversely affect device reliability. Functional operation at absolute-maximum-rated

conditions is not implied.

Symbol

Characteristics

Min

Max

Unit

Condition

Supply Voltage

–0.3

3.9

V

DC Input Voltage

–0.3

V

DC Output Voltage

–0.3

V

DC Input Current

±20

mA

DC Output Current

±50

mA

Storage Temperature

–65

125

°C