Features

The following are key features of the MSCSM170TAM23CTPAG device:

• SiC Power MOSFET

– High temperature performance

• SiC Schottky Diode

– Zero reverse recovery

– Zero forward recovery

– Temperature independent switching behavior

– Positive temperature coefficient on VF

• Very low stray inductance

• Internal thermistor for temperature monitoring

• Aluminum nitride (AlN) substrate for improved thermal performance

Benefits

The following are the benefits of MSCSM170TAM23CTPAG device:

• High power and efficiency converters and inverters

• Outstanding performance at high frequency operation

• Direct mounting to heatsink (isolated package)

• Low junction-to-case thermal resistance

• Solderable terminals for power and signal for easy mounting of PCB

• Low profile

• RoHS compliant

Application

The MSCSM170TAM23CTPAG device is designed for the following applications:

• Welding converters

• Switched mode power supplies

• Uninterruptible power supplies

• EV motor and traction drive

MSCSM170TAM23CTPAG

Datasheet

DS00003965A-page 2