ADP5041ACPZ-1-R7 datasheet(7/40 Pages) AD

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Data Sheet

ADP5041

Rev. B | Page 7 of 40

ABSOLUTE MAXIMUM RATINGS

Table 6.

Parameter

Rating

AVIN to AGND

−0.3 V to +6 V

VIN1 to AVIN

−0.3 V to +0.3 V

PGND to AGDN

−0.3 V to +0.3 V

VIN2, VIN3, VOUTx, ENx, MODE, MR, WDI,

nRSTO, FBx, VTHR, SW to AGND

−0.3 V to (AVIN + 0.3 V)

SW to PGND

−0.3 V to (VIN1 + 0.3 V)

Storage Temperature Range

−65°C to +150°C

Operating Junction Temperature Range

−40°C to +125°C

Soldering Conditions

JEDEC J-STD-020

ESD Human Body Model

3000 V

ESD Charged Device Model

1500 V

ESD Machine Model

200 V

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to

PCB thermal design is required.

Table 7. Thermal Resistance

Package Type

θJA

θJC

Unit

20-Lead, 0.5 mm pitch LFCSP

4.2

°C/W

ESD CAUTION

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