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AS3956 Datasheet(PDF) 9 Page - ams AG |
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AS3956 Datasheet(HTML) 9 Page - ams AG |
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9 / 107 page  ams Datasheet Page 9 [v1-11] 2018-Nov-14 Document Feedback AS3956 − Absolute Maximum Ratings Temperature Ranges and Storage Conditions Tstrg Storage temperature -55 150 °C Tbody Package body temperature 260 °C IPC/JEDEC J-STD-020. The reflow peak soldering temperature (body temperature) is specified according IPC/JEDEC J-STD-020 “Moisture/Reflow Sensitivity Classification for Non-hermetic Solid State Surface Mount Devices.” The lead finish for Pb-free leaded packages is matte tin (100% Sn). RHNC Relative humidity non-condensing 585 % MSL Moisture sensitivity level for MLPD package 3 Represents a max. floor life time of 168h Moisture sensitivity level for thin WL-CSP 1 Represents an unlimited floor life time Symbol Parameter Min Max Unit Comments |
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