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PCF85363ATL/A Datasheet(PDF) 76 Page - NXP Semiconductors |
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PCF85363ATL/A Datasheet(HTML) 76 Page - NXP Semiconductors |
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76 / 86 page ![]() NXP Semiconductors PCF85363A Tiny Real-Time Clock/calendar with 64 byte RAM, alarm function, battery switch-over time stamp input, and I2C-bus Studies have shown that small packages reach higher temperatures during reflow soldering, see Figure 46. 001aac844 temperature time minimum peak temperature = minimum soldering temperature maximum peak temperature = MSL limit, damage level peak temperature MSL: Moisture Sensitivity Level Figure 46. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”. 21 Footprint information sot505-1_fr occupied area solder lands Dimensions in mm 3.200 3.600 5.750 0.725 0.650 0.125 0.450 0.600 3.600 2.950 0.125 1.150 5.500 Figure 47. Footprint information for reflow soldering of SOT505-1 (TSSOP8), PCF85363ATT PCF85363A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2021. All rights reserved. Product data sheet Rev. 3.1 — 18 June 2021 76 / 86 |
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