SP4427DS/01

SP4427 Electroluminescent Lamp Driver

© Copyright 1997 Sipex Corporation

2

Bonding Diagram:

SPECIFICATIONS

(T= 25

°C; V

PARAMETER

MIN.

TYP.

MAX.

UNIT

CONDITIONS

INPUT CHARACTERISTICS

Supply Voltage

1.5

Volts

Total Supply Current

10

15

mA

Vdd= 1.5V

±5%; Hon= 1.5V

Quiescent Supply Current

100

200

nA

Vdd= 1.5V

±5%; Hon= 0.2V

Hon Voltage On

1.1

Vdd

Volts

Hon Current On

10

µA

Internal pulldown

Hon Voltage Off

<Vdd/2

Volts

INDUCTOR DRIVE

Peak Current

60

mA

Pulse Rate

3

5

6

kHz

Duty Cycle

70

75

85

%

LAMP OUTPUT

Differential Voltage

80

110

Vpp

Frequency

150

250

350

Hz

Lamp Capacitance

8000

pF

ABSOLUTE MAXIMUM RATINGS

These are stress ratings only and functional operation of the device at

these ratings or any other above those indicated in the operation sections

of the specifications below is not implied. Exposure to absolute maximum

rating conditions for extended periods of time may affect reliability.

V

Input Voltages/Currents

HON (pin1)..........................................-0.5V to (V

COIL (pin3)............................................................100mA

Lamp Outputs.............................................................................250Vpp

Storage Temperature....................................................-65˚C to +150˚C

Power Dissipation.......................................................................200mW

PAD

X

Y

EL1

586.0

107.0

EL2

586.0

-143.0

COIL

586.0

-376.0

VSS

80.0

-417.0

HON

562.5

-397.0

CAP2

565.0

-118.0

CAP1

562.5

114.5

VDD

588.0

417.0

NOTES:

1. Dimensions are in Microns unless otherwise noted.

2. Bonding pads are 125x125 typ.

3. Outside dimensions are maximum, including scribe area.

4. Die thickness is 380 +/- 25 microns (15 mils +/- 1).

5. Pad center coordinates are relative to die center.

6. Die size 1498 x 1168 ( 59 x 46 mils).

COIL

VSS

EL 1

EL 2

ELEN

SP4427

CAP 1

CAP 2

VDD

664A