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MSK115 Datasheet(PDF) 3 Page - M.S. Kennedy Corporation |
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MSK115 Datasheet(HTML) 3 Page - M.S. Kennedy Corporation |
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3 / 5 page ![]() APPLICATION NOTES HEAT SINKING To determine if a heat sink is necessary for your application and if so, what type, refer to the thermal model and governing equation below. Governing Equation: Example: In our example the amplifier application requires the output to drive a 20 volt peak sine wave across a 20 ohm load for 1 amp of output current. For a worst case analysis we will treat the 1 amp peak output current as a D.C. output current. The power supplies are ±40 VDC. 1.) Find Power Dissipation PD =[(quiescent current) x (VS-(VS))]+[(+VS-VO) x IOUT] =(25mA) x (80V)+(20V) x (1A) =2W+20W =22W 2.) For conservative design, set TJ=+125°C 3.) For this example, worst case TA=+50°C 4.) RθJC=0.55°C/W from MSK 115B Data Sheet 5.) RθCS=0.15°C/W for most thermal greases 6.) Rearrange governing equation to solve for RθSA RθSA =((TJ-TA)/PD) - (RθJC) - (RθCS) =((125°C -50°C)/22W) - (0.55°C/W) - (0.15°C/W) =2.71°C/W The heat sink in this example must have a thermal resistance of no more than 2.71°C/W to maintain a junction temperature of no more than +125°C. Rev. A 6/02 3 TJ=PD x (RθJC + RθCS + RθSA) + TA Where TJ=Junction Temperature PD=Total Power Dissipation RθJC=Junction to Case Thermal Resistance RθCS=Case to Heat Sink Thermal Resistance RθSA=Heat Sink to Ambient Thermal Resistance TC=Case Temperature TA=Ambient Temperature TS=Sink Temperature Thermal Model: CURRENT LIMIT The MSK 115 has an on-board current limit scheme designed to shut off the output drivers anytime output current exceeds a prede- termined limit. The following formula may be used to determine the value of current limit resistance necessary to establish the desired current limit. RCL=(OHMs)=(0.65 volts/current limit in amps) - 0.01OHM The 0.01 ohm term takes into account any wire bond and lead resistance. Since the 0.65 volt term is obtained from the base emitter voltage drop of a bipolar transistor: the equation only holds true for operation at +25°C case temperature. The curve below illustrates the effect of case temperature on current limit. POWER SUPPLY BYPASSING Both the negative and the positive power supplies must be effectively decoupled with a high and low frequency bypass circuit to avoid power supply induced oscillation. An effective decoupling scheme consists of a 0.1 microfarad ceramic capacitor in parallel with a 4.7 microfarad tantalum capacitor from each power supply pin to ground. It is also a good practice with very high power op-amps, such as the MSK 115, to place a 30-50 microfarad non-electrolytic capacitor with a low effective series resistance in parallel with the other two power supply decoupling capacitors. This capacitor will eliminate any peak output voltage clipping which may occur due to poor power supply load regulation. All power supply decoupling capacitors should be placed as close to the package power supply pins as possible (pins 7 and 12). |
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