ADM3053

Data Sheet

Rev. E | Page 18 of 18

OUTLINE DIMENSIONS

CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS

(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR

REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.

COMPLIANT TO JEDEC STANDARDS MS-013-AC

13.00 (0.5118)

12.60 (0.4961)

0.30 (0.0118)

0.10 (0.0039)

2.65 (0.1043)

2.35 (0.0925)

10.65 (0.4193)

10.00 (0.3937)

7.60 (0.2992)

7.40 (0.2913)

0.75 (0.0295)

0.25 (0.0098) 45°

1.27 (0.0500)

0.40 (0.0157)

COPLANARITY

0.10

0.33 (0.0130)

0.20 (0.0079)

0.51 (0.0201)

0.31 (0.0122)

SEATING

PLANE

8°

0°

20

11

10

1

1.27

(0.0500)

BSC

Figure 33. 20-Lead Standard Small Outline Package [SOIC_W]

Wide Body

(RW-20)

Dimensions shown in millimeters and (inches)

ORDERING GUIDE

Temperature Range

Package Description

Package

Option

ADM3053BRWZ

−40°C to +85°C

20-Lead Standard Small Outline Package [SOIC_W]

RW-20

ADM3053BRWZ-REEL7

−40°C to +85°C

20-Lead Standard Small Outline Package [SOIC_W]

RW-20

EVAL-ADM3053EBZ

Evaluation Board

EZLINX-IIIDE-EBZ

iCoupler Isolated Interface Development Environment Evaluation Board

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registered trademarks are the property of their respective owners.

D09293-0-12/17(E)